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datashee t product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays. 1/14 tsz02201-0r6r0a600110-1-2 26.jun.2012 rev.001 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 www.rohm.com 300ma variable output ldo regulator ba3662cp-v5 general description the ba3662cp-v5 is low-saturation regulator. the output voltage can be arbitrarily configured using the external resistance. this ic has a built-in over-current protec tion circuit that prevents the destruction of the ic due to output short circuits and a thermal shutdown circuit that protects the ic from thermal damage due to overloading. features ? high output voltage precision : 2% ? low saturation with pnp output ? built-in over-current prot ection circuit that prevents the destruction of the ic due to output short circuits ? built-in thermal shutdown circuit for protecting the ic from thermal damage due to overloading ? built-in over- voltage protection circuit that prevents the destruction of the ic due to power supply surges key specifications ? input power supply voltage: 25v(max.) ? output voltage type: fixed ? output current: 0.3a(max.) ? shutdown current: 0 a(typ.) ? operating temperature range: -40 to +125 applications audiovisual equipments, fpds, televisions, personal computers or any other consumer device typical application circuit package w (typ.) x d (typ.) x h (max.) to220cp-v5 10.00mm x 20.12mm x 4.60mm ordering information b a 3 6 6 2 c p - v 5 - e 2 part number package cp-v5: to220cp-v5 packaging and forming specification e2: embossed tape and reel lineup maximum output current (max.) output voltage (max.) package orderable part number 0.3a 15v to220cp-v5 reel of 500 BA3662CP-V5E2 to220cp-v5 r 1 v o v cc ctl gnd r 2 c c out c in c in ,c out : ceramic capacitor downloaded from: http:///
2/14 ba3662cp-v5 datasheet tsz02201-0r6r0a600110-1-2 26.jun.2012 rev.001 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com block diagram pin configuration pin description pin no. pin name function 1 ctl output control pin 2 vcc power supply pin 3 gnd gnd 4 vo output pin 5 c adjustable pin fig.1 v o c gnd v cc ctl downloaded from: http:///
3/14 ba3662cp-v5 datasheet tsz02201-0r6r0a600110-1-2 26.jun.2012 rev.001 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com absolute maximum ratings (ta=25 ) parameter symbol ratings unit supply voltage 1 vcc -0.3 to +35.0 v output control voltage v ctl -0.3 to +vcc v power dissipation 2 pd 2000 mw operating temperature ra nge topr -40 to +125 storage temperature range tstg -55 to +150 maximum junction temperature tjmax +150 peak supply voltage 3 vcc peak +50 v 1 not to exceed pd. 2 to220cp-v5:derating in done at 16mw/ for operating above ta 25 .(without heat sink) 3 applied voltage : 200msec or less (tr 1msec) note : this product is not designed for protection against radioactive rays. recommended operating ratings (ta=-40 to +125 ) parameter symbol min. max. unit supply voltage vcc 4.0 25.0 v output control voltage v ctl 0 vcc v output current io 0 0.3 a output voltage vo 3.0 15.0 v protect features parameter symbol min. typ. max. unit over voltage protection vcc 26 28 30 v electrical characteristics(unl ess otherwise specified, ta=25 , vcc=10v,v ctl =5v,io=200ma,r1=2.2k , r2=6.8k ) parameter symbol min. typ. max. unit conditions shut down current isd 0 10 a v ctl =0v bias current ib 2.5 5.0 ma v ctl =2v, io=0ma c terminal voltage vc 1.200 1.225 1.250 v io=50ma dropout voltage S vd 0.3 0.5 v vcc=vo 0.95 ripple rejection r.r. 45 55 db f=120hz, ein 1 =1vrms, io=100ma line regulation reg.i 20 100 mv vcc=6 25v load regulation reg.l 40 80 mv io=5ma 200ma temperature coefficient of output voltage tcvo 0.02 %/ io=5ma,tj=0 to 125 short current ios 0.1 a vcc=25v,vo=0v on mode voltage vthh 2.0 v active mode, io=0ma off mode voltage vthl 0.8 v off mode, io=0ma input high current i ctl 100 200 300 a v ctl =5v, io=0ma 1 ein : input voltage ripple max200msec (voltage supply more than 35v) 50v 35v 0v tr 1msec downloaded from: http:///
4/14 ba3662cp-v5 datasheet tsz02201-0r6r0a600110-1-2 26.jun.2012 rev.001 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com typical performance curves ba3662cp-v5(5.0v preset voltage) (unless otherwise specified, ta=25 , vcc=10v,v ctl =5v,io=200ma,r1=2.2k , r2=6.8k ) fig.2 circuit current fig.3 line regulation fig.4 line regulation (io=200ma) fig.5 load regulation downloaded from: http:///
5/14 ba3662cp-v5 datasheet tsz02201-0r6r0a600110-1-2 26.jun.2012 rev.001 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com typical performance curves - continued fig.8 output voltage fig.9 circuit current (lo=0ma 300ma) (ifeedback_r P 555a) fig.6 dropout voltage io- vd characteristics (vcc=4.75v) fig.7 ripple rejection (lo=100ma) downloaded from: http:///
6/14 ba3662cp-v5 datasheet tsz02201-0r6r0a600110-1-2 26.jun.2012 rev.001 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com typical performance curves - continued fig.12 overvoltage operating (lo = 200ma) fig.13 thermal shutdown circuit characteristics fig.10 ctl voltage vs ctl current fig.11 ctl voltage vs output voltage downloaded from: http:///
7/14 ba3662cp-v5 datasheet tsz02201-0r6r0a600110-1-2 26.jun.2012 rev.001 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com measurement circuit of fig.4 1 f 5v measurement circuit of fig.5 1 f 5v measurement circuit of fig.7 1 f 5v measurement circuit of fig.8 vcc ctl gnd vo adj 1 f 5v measurement circuit of fig.9 1 f 10v measurement circuit of fig.10 1 f 10v measurement circuit of fig.11 measurement circuit of fig.12 a a 4.75v v 100ma 10v 10v a a 10v i feedback _r v a 1 f 5v measurement circuit of fig.1 vcc ctl gnd vo adj i feedback _r 2.2k 6.8k 22 f + 1 f measurement circuit of fig.2 2.2k 6.8k 22 f + v vcc ctl gnd vo adj 5v measurement circuit of fig.3 1 f 2.2k 6.8k 22 f + v vcc ctl gnd vo adj 200ma vcc ctl gnd vo adj 2.2k 6.8k 22 f + vcc ctl gnd vo adj 2.2k 6.8k 22 f + measurement circuit of fig.6 1 f 5v 10v 1vrms 2.2k 6.8k 22 f + vcc ctl gnd vo adj vcc ctl gnd vo adj 2.2k 6.8k 22 f + 2.2k 6.8k 22 f + vcc ctl gnd vo adj 2.2k 6.8k 22 f + v vcc ctl gnd vo adj 2.2k 6.8k 22 f + 1 f 5v 10v v vcc ctl gnd vo adj 2.2k 6.8k 22 f + 200ma 1 f 5v 10v v vcc ctl gnd vo adj 2.2k 6.8k 22 f + measurement circuit for typical performance curves measurement circuit of fig.2 measurement circuit of fig.3 measurement circuit of fig.4 measurement circuit of fig.5 measurement circuit of fig.6 measurement circuit of fig.7 measurement circuit of fig.8 measurement circuit of fig.9 measurement circuit of fig.10 measurement circuit of fig.11 measurement circuit of fig.12 measurement circuit of fig.13 downloaded from: http:///
8/14 ba3662cp-v5 datasheet tsz02201-0r6r0a600110-1-2 26.jun.2012 rev.001 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com i/o equivalence circuit vcc pin ctl pin vo pin c pin output voltage configuration method please connect resistors r1 and r2 (which determines the output voltage) as shown in fig.14. please be aware that the offset due to the current that flows from t he c pin becomes large when resistors with large values are used. the use of resistors with r1=2k to 15k is recommended. v o P vc (r1+r2) / r1 fig.14 vcc ic ctl 25k 25k vo vcc 10 k c 5.5 k vc P 1.225v (typ.) r2 r1 vo c pin ic downloaded from: http:///
9/14 ba3662cp-v5 datasheet tsz02201-0r6r0a600110-1-2 26.jun.2012 rev.001 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com power dissipation when using at temperatures over ta=25 , please refer to the heat reducing characteristics shown in fig.15. the ic characteristics are closely related to the temperature at which the ic is used, so it is necessary to operate the ic at temperatures less than the maxi mum junction temperature tjmax. fig.15 shows the acceptable loss and heat reducing characte ristics of the to220cp-v5 package. even when the ambient temperature ta is a normal temperature (25 ), the chip (junction) temperature tj may be quite high so please operate the ic at temperatures less than the acceptable loss pd. the calculation method for power consumption pc(w) is as follows. pc=(vcc vo) io+vcc ib acceptable loss pd pc solving this for load current io in order to operate within the acceptable loss, (please refer to fig.9 for ib.) it is then possible to find the maximum load current io max with respect to the applied voltage vcc at the time of thermal design. calculation example) when ta=85 ,vcc=10v,vo=5v please refer to the above information and keep thermal desig ns within the scope of acceptable loss for all operating temperature ranges. the power consumption pc of the ic when there is a short circuit (short between vo and gnd) is : pc=vcc (ib+ishort) (please refer to fig.5 for ishort.) io pd vcc ib vcc vo with the ic alone : ja=62.5 /w -16mw/ 25 =2.0w 85 =1.04w vcc: vo: io: ib: ishort: input voltage output voltage load current circuit current short current io 192ma (ib:8ma) io 1.04 10 ib 5 fig.15 0 5 10 15 20 25 0 25 50 75 100 125 150 ambient temperature ta() power dissipation pd w) (1) 20.0 (2) 2.0 (1)when using a maximum heat sick : jc=6.25( /w) (2)when using an ic alone : ja=62.5( /w) downloaded from: http:///
10/14 ba3662cp-v5 datasheet tsz02201-0r6r0a600110-1-2 26.jun.2012 rev.001 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com operational notes 1. absolute maximum ratings use of the ic in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may result in damage to the ic. assumptions should not be made regarding the state of the ic (e.g., short mode or open mode) when such damage is suffered. if operational values ar e expected to exceed the maximum ratings for the device, consider adding protective circuitry (such as fuses) to eliminate the risk of damaging the ic. 2. electrical characteristics described in these specifications may vary, depending on temperature, supply voltage, external circuits and other conditions. therefore, be sure to check a ll relevant factors, includin g transient characteristics. 3. gnd potential the potential of the gnd pin must be the minimum potential in the system in all operating conditions. ensure that no pins are at a voltage below the gnd at any time , regardless of transient characteristics. 4. ground wiring pattern when using both small-signal and lar ge-current gnd traces, the two ground tr aces should be routed separately but connected to a single ground potential within the application in order to avoid variat ions in the small-signal ground caused by large currents. also ensure that the gnd traces of external components do not cause variations on gnd voltage. the power supply and ground lines must be as short and thick as possible to reduce line impedance. 5. inter-pin shorts and mounting errors use caution when orienting and positioning the ic for mounting on printed circuit boards. improper mounting may result in damage to the ic. shorts between output pins or between output pi ns and the power supply or gnd pins (caused by poor soldering or foreign objects) may result in damage to the ic. 6. operation in strong electromagnetic fields using this product in strong electromagnet ic fields may cause ic malfunction. caut ion should be exercised in applications where strong electromagnetic fields may be present. 7. testing on application boards when testing the ic on an application board, connecting a capaci tor directly to a low-impedance pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from a jig or fixture during the ev aluation process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 8. power dissipation if ic is used on condition that the power loss is over the powe r dissipation, the reliability will become worse by heat up. the power dissipation that is described to the absolute maximum rating in this specification is a valu e when the heat sink is not populated. in this case it exceed the power dissipation, please consider using the heat sink,etc. also, be sure to use this ic within a power dissipation range allowing enough of margin. 9. thermal consideration use a thermal design that allows for a sufficient margin in light of the pd in act ual operating conditions. consider pc that does not exceed pd in actual operating conditions. (pd pc) tjmax : maximum junction temperature=150 , ta : peripheral temperature [ ], ja : thermal resistance of package-ambience[ /w], pd : package power dissipation [w], pc : power dissipation [w], vcc : input voltage, vo : output voltage, io : load, ib : bias current package power dissipation : pd (w)=(tjmax ta ) / ja power dissipation : pc (w)=(vcc vo ) io+vcc ib 10. vcc pin insert a capacitor (capacitor above 0.33f) between the vcc and gnd pins. t he appropriate capacitance value varies by application. be sure to allow a sufficient margin for input voltage levels. downloaded from: http:///
11/14 ba3662cp-v5 datasheet tsz02201-0r6r0a600110-1-2 26.jun.2012 rev.001 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com 300 0.1 1 10 cout_esr 100 0 200 100 unstable operating region stable operating region unstable operating region fig.16 cout_esr vs io (reference data) io[ma] operation note 11 measurement circuit cout (22f) vcc vo ctl gnd adj r1 r2 cin v ctl (5v) (0.33f) esr io (rout) (above 0.001 ) (2k to 15k ) vcc ( 10v ) vcc=10v v o =5v ta = 2 5 r1=2k to 15k cin=0.33f cout=22f 11. vo terminal please attach an anti-oscillation capacitor between vo and gnd. the capacitance of the capacitor may significantly change due to factors such as temperature changes, which ma y cause oscillations. please use a tantalum capacitor or aluminum electrolytic capacitor with favorable characteri stics and small external series resistance (esr) even at low temperatures. the output oscillates regardle ss of whether the esr is large or small. please use the ic within the stable operating region while referring to the esr characteristics reference data shown in fig.16. in cases where there are sudden load fluctuations, the large capaci tor is recommended. below figure, it is esr-to-io stability area characteristics, measured by 22f-ceramic-capacitor and resistor connected in series. this characteristic is not equal value perfectly to 22f-alumi num electrolytic capacitor in order to measurement method. note, however, that the stable range suggested in the figure depends on the ic and the resistance load involved, and can vary with the boards wiring impedance, input impedance, and/ or load impedance. therefore, be certain to ascertain the final status of these items for actual use. keep capacitor capacitance within a range of 22f to 1000f. it is also recommended that a 0.33f bypass capacitor be connected as close to the input pin-gnd as location possible. however, in situations such as rapid fluctuation of the input voltage or the load, please check the operation in re al application to determine proper capacitance. 12. over current protection circuit (ocp) the ic incorporates an integrated over-cu rrent protection circuit that operates in accordance with the rated output capacity. this circuit serves to protect the ic from damage when the load becomes shorted. it is also designed to limit output current (without latching) in the ev ent of a large and instantaneous current flow from a large capacitor or other component. these protection circuits are effective in preventing damage due to sudden and unexpected accidents. however, the ic should not be used in applications charac terized by the continuous or transitive operation of the protection circuits. 13. thermal shutdown circuit (tsd) the ic incorporates a built-in thermal shutdown circuit, which is designed to turn the ic of f completely in the event of thermal overload. it is not designed to protect the ic fr om damage or guarantee its operat ion. ics should not be used after this function has activated, or in applications where the operation of this circuit is assumed. 14. applications or inspection processes where the potential of the vcc pin or other pins may be reversed from their normal state may cause damage to the ic's internal circuitry or el ements. use an output pin capaci tance of 1000f or lower in case vcc is shorted with the gnd pin while the external capacitor is charged. insert a diode in series with vcc to prevent reverse current flow, or insert bypass diodes between vcc and each pin. 15. positive voltage surges on v cc pin a power zener diode should be inserted between v cc and gnd for protection against vo ltage surges of more than 50v on the v cc pin. vcc gnd downloaded from: http:///
12/14 ba3662cp-v5 datasheet tsz02201-0r6r0a600110-1-2 26.jun.2012 rev.001 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com 16. negative voltage surges on v cc pin a schottky barrier diode should be inserted between v cc and gnd for protection against voltages lower than gnd on the v cc pin. 17. output protection diode loads with large inductance components may cause reverse curr ent flow during startup or shutdown. in such cases, a protection diode should be inserted on the output to protect the ic. 18. regarding input pins of the ic this monolithic ic contains p+ isolati on and p substrate layers between adjacent elements in order to keep them isolated. pn junctions are formed at the intersection of these p layers with the n layers of other elements, creating parasitic diodes and/or transistors. for example (refer to the figure below): when gnd > pin a and gnd > pin b, the pn junction operates as a parasitic diode when gnd > pin b, the pn junction operates as a parasitic transistor parasitic diodes occur inevitably in the structure of the ic, a nd the operation of these parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. accordingly, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. status of this document the japanese version of this document is fo rmal specification. a customer may use this translation version only for a reference to help reading the formal version. if there are any differences in translation version of this document formal version takes priority. vcc gnd parasitic elements parasitic elements or transistors example of simple monolithic ic architecture (pin a) (pin b) c b e n p n n p+ p+ parasitic elements or transistors p substrate (pin b) c b e transistor (npn) (pin a) n p n n p+ p+ resistor parasitic elements p gnd gnd gnd n downloaded from: http:///
13/14 ba3662cp-v5 datasheet tsz02201-0r6r0a600110-1-2 26.jun.2012 rev.001 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com physical dimension tape and reel information marking diagram (unit : mm) to220cp-v5 16.92 0.92 3.2 0.1 4.5 0.1 0.82 0.1 8.0 0.2 1.58 0.42 0.1 12.0 0.2 1.778 1.444 4.92 0.2 10.0 +0.3 - 0.1 2.8 +0.2 - 0.1 13.60 15.2 - 0.2 +0.4 4.12 1.0 0.2 (1.0) (2.85) direction of feed 1pin reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the lower left when you hold reel on the left hand and you pull out the tape on the right hand 500pcs e2 () to220cp-v5 (top view) ba3662 part number marking lot number downloaded from: http:///
14/14 ba3662cp-v5 datasheet tsz02201-0r6r0a600110-1-2 26.jun.2012 rev.001 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com revision history date revision changes 26.jun.2012 001 new release downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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